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PCB Panelization
A panel outline is the contour of a customer panel and normally made during PCB separation of the panel. A breakrouted PCB separation gives a routed panel outline (contours) and V-cut separation will result into a V-cutted panel outline. There varies four types of PCB panelization: Order Paneli...Read more -
PCB technology
With the rapidly change of current modern life which requires much more additional processes that either optimize the performance of your circuit boards in relation to their intended use, or assist with multi-stage assembly processes to reduce labor and improve throughpu...Read more -
Layer Stackup
What is stack-up? Stack-up refers to the arrangement of copper layers and insulating layers that make up a PCB prior to board layout design. While a layer stack-up allows you to get more circuitry on a single board through the various PCB board layers, the structure of PCB stackup design confers ...Read more -
Surface Finish
To meet varies request of clients and achieve the very best assembly performance in production, we need to match the most appropriate solderable finish to your application. In order to satisfy every combination of assembly profile, material use and application requirement, we offer the following ...Read more -
PCB Material
PCB Material In order to meet the different types of circuit board needs of customers all over the world, ANKE PCB is pleased to offer the comprehensive range of standard and specialized laminate and substrate materials to suit your specific application requirements. These general materials will ...Read more -
Expedite service
Quick turn PCB service/pcb expedited service In production side, considering some projects demand short lead time, especially when spend too much time on the PCB design or engineering stage, we ANKE PCB understand that time is very critical. Quick turn pcb service/ pcb expedited service is capabl...Read more -
production process for double layer and multilayers pcb
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PCB capacity
Rigid board capacity Number of layers: 1-42 layers Material: FR4\high TG FR4\Lead free material\CEM1\CEM3\Aluminum\Metal core\PTFE\Rogers Out layer Cu thickness: 1-6OZ Inner layer Cu thickness: 1-4OZ Maximum processing area: 610*1100mm Minimum board th...Read more -
EMC Analysis
Electro Magnetic Compatibility includes electromagnetic interference (EMI) and electromagnetic susceptibility (EMS). The board-level EMC design adopts the idea of focusing on origin control, and measures are taken from the design stage, combining with signal integrity an...Read more -
Simulation
SI, PI, EMC, CAE, DFM， offering comprehensive simulation and design full consideration to simulation analysis for design Extensive practical experience and successful requirements Capable of performing signal simulation analysis over Giga Hz SI Analysis Support IBIS mo...Read more -
PCB layout
Introduction High Quality design Well-built designing management system, strict inspection, effective deadline management makes the design no faulty-given Senior designing team 10+ years of design experience design...Read more
