Rigid board capacity | |
Number of layers: | 1-42 layers |
Material: | FR4\high TG FR4\Lead free material\CEM1\CEM3\Aluminum\Metal core\PTFE\Rogers |
Out layer Cu thickness: | 1-6OZ |
Inner layer Cu thickness: | 1-4OZ |
Maximum processing area: | 610*1100mm |
Minimum board thickness: | 2 layers 0.3mm (12mil) |
4 layers 0.4mm (16mil) | |
6 layers 0.8mm (32mil) | |
8 layers 1.0mm (40mil) | |
10 layers 1.1mm (44mil) | |
12 layers 1.3mm (52mil) | |
14 layers 1.5mm (59mil) | |
16 layers 1.6mm (63mil) | |
Minimum Width: | 0.076mm (3mil) |
Minimum Space: | 0.076mm (3mil) |
Minimum hole size (final hole): | 0.2mm |
Aspect ratio: | 10:01 |
Drilling hole size: | 0.2-0.65mm |
Drilling tolerance: | +\-0.05mm(2mil) |
PTH tolerance: | Φ0.2-1.6mm +\-0.075mm (3mil) |
Φ1.6-6.3mm+\-0.1mm(4mil) | |
NPTH tolerance: | Φ0.2-1.6mm +\-0.05mm(2mil) |
Φ1.6-6.3mm+\-0.05mm(2mil) | |
Finish board tolerance: | Thickness<0.8mm, Tolerance:+/-0.08mm |
0.8mm≤Thickness≤6.5mm,Tolerance+/-10% | |
Minimum soldermask bridge: | 0.076mm (3mil) |
Twisting and bending: | ≤0.75% Min0.5% |
Raneg of TG: | 130-215℃ |
Impedance tolerance: | +/-10%,Min+/-5% |
Surface Treatment: | HASL, LF HASL |
Immersion Gold, Flash Gold,Gold finger | |
Immersion Silver, Immersion Tin,OSP | |
Selective Gold Plating, Gold thickness up to 3um(120u”) | |
Carbon Print, Peelable S/M,ENEPIG | |
Aluminum board capacity | |
Number of layers: | Single layer, double layers |
Maximum board size: | 1500*600mm |
Board thickness: | 0.5-3.0mm |
Copper thickness: | 0.5-4oz |
Minimum hole size: | 0.8mm |
Minimum width: | 0.1mm |
Minimum space: | 0.12mm |
Minimum pad size: | 10 micron |
Surface finish: | HASL,OSP,ENIG |
Shaping: | CNC, Punching, V-cut |
Equipement: | Universal Tester |
Flying Probe Open/Short Tester | |
High power Microscope | |
Solderability Testing Kit | |
Peel Strength tester | |
High Volt Open & Short tester | |
Cross Section Molding Kit With Polisher | |
FPC Capacity | |
Layers: | 1-8 layers |
Board thickness: | 0.05-0.5mm |
Copper thickness: | 0.5-3OZ |
Minimum Width: | 0.075mm |
Minimum space: | 0.075mm |
In through hole size: | 0.2mm |
Minimum laser hole size: | 0.075mm |
Minimum punching hole size: | 0.5mm |
Soldermask tolerance: | +\-0.5mm |
Minimum routing dimension tolerance: | +\-0.5mm |
Surface finish: | HASL,LF HASL, Immersion Silver, Immersion Gold,Flash Gold, OSP |
Shaping: | Punching, Laser, Cut |
Equipement: | Universal Tester |
Flying Probe Open/Short Tester | |
High power Microscope | |
Solderability Testing Kit | |
Peel Strength tester | |
High Volt Open & Short tester | |
Cross Section Molding Kit With Polisher | |
Rigid&flex capacity | |
Layers: | 1-28 layers |
Material type: | FR-4(High Tg, Halogen Free, High Frequency) |
PTFE, BT, Getek, Aluminium base,Copper base,KB, Nanya, Shengyi, ITEQ, ILM, Isola, Nelco, Rogers, Arlon | |
Board thickness: | 6-240mil/0.15-6.0mm |
Copper thickness: | 210um (6oz) for inner layer 210um (6oz) for outer layer |
Min mechanical drill size: | 0.2mm/0.08” |
Aspect ratio: | 2:01 |
Max panel size: | Sigle side or double sides:500mm*1200mm |
Multilayer layers:508mm X 610mm (20″ X 24″) | |
Min line width/space: | 0.076mm / 0.076mm (0.003″ / 0.003″)/ 3mil/3mil |
Via hole type: | Blind / Buried / Plugged(VOP,VIP…) |
HDI / Microvia: | YES |
Surface finish: | HASL, LF HASL |
Immersion Gold, Flash Gold,Gold finger | |
Immersion Silver, Immersion Tin,OSP | |
Selective Gold Plating, Gold thickness up to 3um(120u”) | |
Carbon Print, Peelable S/M,ENEPIG | |
Shaping: | CNC, Punching, V-cut |
Equipement: | Universal Tester |
Flying Probe Open/Short Tester | |
High power Microscope | |
Solderability Testing Kit | |
Peel Strength tester | |
High Volt Open & Short tester | |
Cross Section Molding Kit With Polisher |
Post time: Sep-05-2022