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                            Rigid board capacity
Number of layers: 1-42 layers
Material: FR4\high TG FR4\Lead free material\CEM1\CEM3\Aluminum\Metal core\PTFE\Rogers
Out layer Cu thickness: 1-6OZ
Inner layer Cu thickness: 1-4OZ
Maximum processing area: 610*1100mm
Minimum board thickness: 2 layers 0.3mm (12mil)
4 layers 0.4mm (16mil)
6 layers 0.8mm (32mil)
8 layers 1.0mm (40mil)
10 layers 1.1mm (44mil)
12 layers 1.3mm (52mil)
14 layers 1.5mm (59mil)
16 layers 1.6mm (63mil)
Minimum Width: 0.076mm (3mil)
Minimum Space: 0.076mm (3mil)
Minimum hole size (final hole): 0.2mm
Aspect ratio: 10:01
Drilling hole size: 0.2-0.65mm
Drilling tolerance: +\-0.05mm(2mil)
PTH tolerance: Φ0.2-1.6mm +\-0.075mm (3mil)
Φ1.6-6.3mm+\-0.1mm(4mil)
NPTH tolerance: Φ0.2-1.6mm +\-0.05mm(2mil)
Φ1.6-6.3mm+\-0.05mm(2mil)
Finish board tolerance:  Thickness<0.8mm, Tolerance:+/-0.08mm
0.8mm≤Thickness≤6.5mm,Tolerance+/-10%
Minimum soldermask bridge: 0.076mm (3mil)
Twisting and bending: ≤0.75% Min0.5%
Raneg of TG: 130-215℃
Impedance tolerance: +/-10%,Min+/-5%
Surface Treatment: HASL, LF HASL
     Immersion Gold, Flash Gold,Gold finger
Immersion Silver, Immersion Tin,OSP
Selective Gold Plating, Gold thickness up to 3um(120u”)
Carbon Print, Peelable S/M,ENEPIG
Aluminum board capacity
Number of layers: Single layer, double layers
Maximum board size: 1500*600mm
Board thickness: 0.5-3.0mm
Copper thickness: 0.5-4oz
Minimum hole size: 0.8mm
Minimum width: 0.1mm
Minimum space: 0.12mm
Minimum pad size: 10 micron
Surface finish: HASL,OSP,ENIG
Shaping: CNC, Punching, V-cut
Equipement:       Universal Tester
Flying Probe Open/Short Tester
High power Microscope
Solderability Testing Kit
Peel Strength tester
High Volt Open & Short tester
Cross Section Molding Kit With Polisher
FPC Capacity
Layers: 1-8 layers
Board thickness: 0.05-0.5mm
Copper thickness: 0.5-3OZ
Minimum Width: 0.075mm
Minimum space: 0.075mm
In through hole size: 0.2mm
Minimum laser hole size: 0.075mm
Minimum punching hole size: 0.5mm
Soldermask tolerance: +\-0.5mm
Minimum routing dimension tolerance: +\-0.5mm
Surface finish: HASL,LF HASL, Immersion Silver, Immersion Gold,Flash Gold, OSP
Shaping: Punching, Laser, Cut
Equipement:       Universal Tester
Flying Probe Open/Short Tester
High power Microscope
Solderability Testing Kit
Peel Strength tester
High Volt Open & Short tester
Cross Section Molding Kit With Polisher
Rigid&flex capacity
Layers: 1-28 layers
Material type: FR-4(High Tg, Halogen Free, High Frequency)
PTFE, BT, Getek, Aluminium base,Copper base,KB, Nanya, Shengyi, ITEQ, ILM, Isola, Nelco, Rogers, Arlon
Board thickness: 6-240mil/0.15-6.0mm
Copper thickness: 210um (6oz) for inner layer 210um (6oz) for outer layer
Min mechanical drill size: 0.2mm/0.08”
Aspect ratio: 2:01
Max panel size:  Sigle side or double sides:500mm*1200mm
Multilayer layers:508mm X 610mm (20″ X 24″)
Min line width/space: 0.076mm / 0.076mm (0.003″ / 0.003″)/ 3mil/3mil
Via hole type: Blind / Buried / Plugged(VOP,VIP…)
HDI / Microvia: YES
Surface finish:     HASL, LF HASL
Immersion Gold, Flash Gold,Gold finger
Immersion Silver, Immersion Tin,OSP
Selective Gold Plating, Gold thickness up to 3um(120u”)
Carbon Print, Peelable S/M,ENEPIG
Shaping: CNC, Punching, V-cut
Equipement:       Universal Tester
Flying Probe Open/Short Tester
High power Microscope
Solderability Testing Kit
Peel Strength tester
High Volt Open & Short tester
Cross Section Molding Kit With Polisher

 


Post time: Sep-05-2022